MC14536BCP DIP IC

SPECIFICATIONS

Mfr Package Description PLASTIC, DIP-16
Status Active
JESD-30 Code R-PDIP-T16
JESD-609 Code e0
Number of Terminals 16
Package Body Material PLASTIC/EPOXY
Package Code DIP
Package Shape RECTANGULAR
Package Style IN-LINE
Peak Reflow Temperature (Cel) 240
Qualification Status Not Qualified
Seated Height-Max 4.44 ?mm
Surface Mount NO
Technology CMOS
Temperature Grade MILITARY
Terminal Finish Tin/Lead (Sn80Pb20)
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 ?mm
Terminal Position DUAL
Time@Peak Reflow Temperature-Max (s) 30
Length 19.175 ?mm
Width 7.62 ?mm

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