| Mfr Package Description | PLASTIC, DIP-24 |
| Status | Discontinued |
| Access Time-Max | 450.0 ?ns |
| JESD-30 Code | R-PDIP-T24 |
| JESD-609 Code | e0 |
| Memory Density | 1024.0 ?bit |
| Memory IC Type | STANDARD SRAM |
| Memory Width | 8 |
| Number of Functions | 1 |
| Number of Ports | 1 |
| Number of Terminals | 24 |
| Number of Words | 128.0 ?words |
| Number of Words Code | 128 |
| Operating Mode | ASYNCHRONOUS |
| Operating Temperature-Min | 0.0 ?Cel |
| Operating Temperature-Max | 70.0 ?Cel |
| Organization | 128X8 |
| Output Characteristics | 3-STATE |
| Output Enable | NO |
| Package Body Material | PLASTIC/EPOXY |
| Package Code | DIP |
| Package Shape | RECTANGULAR |
| Package Style | IN-LINE |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Qualification Status | Not Qualified |
| Seated Height-Max | 5.08 ?mm |
| Supply Voltage-Nom (Vsup) | 5.0 ?V |
| Supply Voltage-Min (Vsup) | 4.75 ?V |
| Supply Voltage-Max (Vsup) | 5.25 ?V |
| Surface Mount | NO |
| Technology | NMOS |
| Temperature Grade | COMMERCIAL |
| Terminal Finish | Tin/Lead (Sn/Pb) |
| Terminal Form | THROUGH-HOLE |
| Terminal Pitch | 2.54 ?mm |
| Terminal Position | DUAL |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Length | 31.75 ?mm |
| Width | 15.24 ?mm |
