Features
? Glass passivated chip junction EPI wafer
? Ultrafast recovery time for high efficiency
? Low reverse leakage current
? High surge capacity
Mechanical Data
? Case: TO-220AC heatsink
? Terminals: Lead solderable per MIL-STD-202, Method 208
? Polarity: As marked
? Standard packaging: Any
? Weight: 2.5 gram approximately
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