Mfr Package Description | DIP-14 |
Status | Active |
Logic IC Type | NAND GATE |
Sub Category | Gates |
Family | S |
JESD-30 Code | R-GDIP-T14 |
Load Capacitance (CL) | 50.0 ?pF |
Max I(ol) | 0.04 ?Amp |
Number of Functions | 2 |
Number of Inputs | 4.0 |
Number of Terminals | 14 |
Operating Temperature-Min | -55.0 ?Cel |
Operating Temperature-Max | 125.0 ?Cel |
Package Body Material | CERAMIC, GLASS-SEALED |
Package Code | DIP |
Package Equivalence Code | DIP14,.3 |
Package Shape | RECTANGULAR |
Package Style | IN-LINE |
Packing Method | TUBE |
Peak Reflow Temperature (Cel) | NOT SPECIFIED |
Power Supply Current-Max (ICC) | 44.0 ?mA |
Prop. Delay@Nom-Sup | 6.5 ?ns |
Propagation Delay (tpd) | 6.5 ?ns |
Qualification Status | Not Qualified |
Schmitt Trigger | NO |
Screening Level | MIL-PRF-38535 |
Seated Height-Max | 5.08 ?mm |
Supply Voltage-Nom (Vsup) | 5 |
Supply Voltage-Min (Vsup) | 4.5 ?V |
Supply Voltage-Max (Vsup) | 5.5 ?V |
Surface Mount | NO |
Technology | TTL |
Temperature Grade | MILITARY |
Terminal Form | THROUGH-HOLE |
Terminal Pitch | 2.54 ?mm |
Terminal Position | DUAL |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
Length | 19.56 ?mm |
Width | 6.67 ?mm |
Additional Feature | IOL = 60MA @ VOL = 0.5V; IOH = 3MA @ VOH = 2.5V; LG-MAX |