Mfr Package Description | PLASTIC, DIP-24 |
Status | Discontinued |
Logic IC Type | ARITHMETIC LOGIC UNIT |
Sub Category | Arithmetic Circuits |
Family | LS |
JESD-30 Code | R-PDIP-T24 |
JESD-609 Code | e0 |
Load Capacitance (CL) | 15.0 ?pF |
Number of Bits | 4 |
Number of Functions | 1 |
Number of Terminals | 24 |
Operating Temperature-Min | -20.0 ?Cel |
Operating Temperature-Max | 75.0 ?Cel |
Package Body Material | PLASTIC/EPOXY |
Package Code | DIP |
Package Equivalence Code | DIP24,.6 |
Package Shape | RECTANGULAR |
Package Style | IN-LINE |
Peak Reflow Temperature (Cel) | NOT SPECIFIED |
Power Supply Current-Max (ICC) | 37.0 ?mA |
Propagation Delay (tpd) | 41.0 ?ns |
Qualification Status | Not Qualified |
Seated Height-Max | 5.08 ?mm |
Supply Voltage-Nom (Vsup) | 5 |
Supply Voltage-Min (Vsup) | 4.75 ?V |
Supply Voltage-Max (Vsup) | 5.25 ?V |
Surface Mount | NO |
Technology | TTL |
Temperature Grade | COMMERCIAL EXTENDED |
Terminal Finish | Tin/Lead (Sn/Pb) |
Terminal Form | THROUGH-HOLE |
Terminal Pitch | 2.54 ?mm |
Terminal Position | DUAL |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
Length | 30.4 ?mm |
Width | 7.62 ?mm |